Sensors have been around for more than 150 years since its birth in 1860s. Now, with the rapid development of the Internet of things, more and more requirements have been put forward for sensor technology. The McKinsey report pointed out that by 2025, things bring economic benefits in 2 trillion and 700 billion to $6 trillion and 200 billion, as an important entrance of IOT sensor sensing layer data acquisition, will also be in the next few years to usher in the explosive growth.
What is a sensor? The sensor is the detection device consisting of a sensitive element and a switching element, can feel is measured, and can detect and feel the information according to certain rules are converted to electrical signals (voltage, current, frequency or phase) in the form of output, the final network used for data analysis, artificial intelligence data the source of material.
At present, the global sensor market is dominated by several leading companies in the United States, Japan and germany. The global sensors are more than 2.2 species, China have conventional types and varieties of about 7000, while more than 90% of the high-end sensor is still heavily dependent on imports, digital, intelligent, miniaturized sensors lack.
At present the main research direction of domestic sensor technology is MEMS (micro electro mechanical system), the microprocessor and sensor are integrated, the intelligent data terminal equipment capable of sensing, data processing, intelligent control and data communication function. As in microelectronics, the smaller feature size of integrated circuit means that the device integration is higher, run faster, better performance of sensor networking system for the smaller size of the system in the layout also means more convenient and better performance. But at the same time, the hardware requirements will be higher, which is the core of the sensor chip, the current domestic large-scale sensor manufacturers less, mainly to small and medium manufacturers, chip material is also based on FR-4 substrate, the aluminum substrate, but in developed countries, has been large-scale application of ceramic substrate, ceramic substrate has better stability, insulation the ability of more excellent thermal conductivity, high as a pearl in the palm world-class sensor manufacturers.
Domestic sensors and foreign technology there is still a certain gap, but we can not see in terms of technology, we have to upgrade the hardware at the same time, after all, hardware is the foundation. At present, the domestic ceramic circuit board development is very rapid, the main technique has thin film technology, thick film technology, screen printing technology, DPC Technology (direct copper technology) and the new LAM Technology (metal technology of laser rapid activation). LAM technology is the most advanced ceramic circuit board processing technology, which can be used for high-density assembly, line / pitch (L/S) resolution can reach 20 m, so as to realize the short, small, light and thin equipment. It is the only choice for promoting MEMS in china.
At present, because the domestic Internet is still in the initial stage, and did not lead to effective communication between many hardware manufacturers and terminal operators, a lot of things there is no way to lead out, terminal manufacturers also do not have that information. In the case of vast territory and abundant resources China manufacturers, not rigid, must go out to use more high-end hardware, driven by technological innovation of the whole industry chain.